“PCB proto” |
“STANDARD pool” |
“RF pool” |
“IMS pool” |
||||
“eC-default technology values” |
“Poolable options” |
“Non poolable options” |
“Poolable options” |
“Non poolable options” |
“Poolable options” |
“Non poolable options” |
|
Number of layers |
2, 4 |
1, 2, 4, 6, 8 |
0, 10, 12, 14, 16 |
2, 4 |
other – ask quotation |
1 |
– |
Max. PCB dimensions |
425mm x 425mm, max 8.75dm² |
425mm x 425mm, max 8.75dm² |
425mm x 425mm and >8.75dm², larger – ask quotation |
425mm x 425mm, max 8.75dm² |
425mm x 425mm and >8.75dm², larger , ask quotation |
550mm x 425mm, max 8.75dm² |
550mm x 425mm and > 8.75dm², larger – ask quotation |
Min. PCB dimensions |
20mm x 20mm |
5mm x 5mm |
– |
5mm x 5mm |
– |
5mm x 5mm |
– |
Base material |
FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C |
FR-4, Td>=325°C, T260>=60’, T288>=5’, CTEz=<3.5%, Tg>=150°C |
Isola 370HR, Td>=340°C, T260>=60’, T288>=30’, CTEz=<2.8%, Tg=180°C |
2L – IS680, Tg 200°C 4L – IS680 + Isola 370HR , Tg180°C |
Rogers RO4000 series, Tg280°C, other – ask quotation |
MOT=130°C, Tg100°C, >=1.3W/mK, CTI=600V, >=5kV, 0.77 K/W |
– |
Base material thickness: 0, 1, 2 layer |
1.55mm |
1.00mm, 1.55mm, 2.40mm |
0.20, 0.36, 0.50, 0.80, 1.20, 2.00, 3.20mm |
0.50mm | other – ask quotation | ALU 1.50mm, 100µm insulation | – |
Base material thickness: Multi Layer |
1.55mm |
1.55mm |
0.36, 0.50, 0.80, 1.00, 1.20, 2.00, 2.40, 3.20mm |
1.55mm | other – ask quotation | – | – |
Base copper foil: 1 Layer |
– |
18µm/½oz, 35µm/1oz |
70µm/2oz-105µm/3oz |
– |
other – ask quotation |
35µm/1oz |
– |
Base copper foil: 2 Layer |
18µm/½oz |
12µm/?oz-18µm/½oz-35µm/1oz |
70µm/2oz-105µm/3oz |
18µm/½oz |
other – ask quotation |
– |
– |
Base copper foil: Multi Layer (outer layer – inner layer) |
18µm/½oz OL – 35µm/1oz IL |
12µm/?oz OL – 18µm/½oz IL, 18µm/½oz OL – 35µm/1oz IL |
eC-predefined build ups, any other – ask quotation |
18µm/½oz OL – 18µm/½oz IL |
other – ask quotation |
– |
– |
Multilayer-build |
eC-standard |
eC-standard |
eC-type 1-7, for specials “ask quotation” |
eC-type 8 |
for specials “ask quotation” |
– |
– |
Extra PTH cycles: blind – buried |
– |
– |
build up to be checked by us |
– |
build up to be checked by us |
– |
– |
Extra press cycles: sequential build up |
– |
– |
build up to be checked by us |
– |
build up to be checked by us |
– |
– |
Min. track width outer layer |
0.150mm |
0.100mm (max.18µm base Cu) |
0.090mm (max.18µm base Cu) |
0.100mm |
0.090mm (max.18µm base Cu) |
0.150mm |
– |
Min. spacing outer layer |
0.150mm |
0.100mm (max.12µm base Cu) |
0.090mm (max.12µm base Cu) |
0.125mm |
0.090mm (max.12µm base Cu) |
0.150mm |
– |
Min. annular ring outer layer |
0.125mm |
0.100mm |
0.100mm |
0.100mm |
0.100mm |
0.125mm |
– |
Min. track width inner layer |
0.150mm |
0.100mm (max.18µm base Cu) |
0.090mm (max.18µm base Cu) |
0.100mm |
0.090mm (max.18µm base Cu) |
– |
– |
Min. spacing inner layer |
0.150mm |
0.100mm (max.18µm base Cu) |
0.090mm (max.12µm base Cu) |
0.100mm |
0.090mm (max.12µm base Cu) |
– |
– |
Min. annular ring inner layer |
0.125mm |
0.125mm |
0.100mm |
0.125mm |
0.100mm |
– |
– |
Min. finished hole size |
0.25mm |
0.10mm (PTH) 0.20mm (NPTH) |
0.10mm (PTH) 0.20mm (NPTH) |
0.10mm (PTH) 0.20mm (NPTH) |
0.10mm (PTH) 0.20mm (NPTH) |
0.60mm |
– |
Min. outer layer pad diameter = selected finished hole size + “value” |
0.350mm (PTH) 0.250mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
0.250mm (NPTH) |
– |
Min. inner layer pad diameter = selected finished hole size + “value” |
0.350mm (PTH) 0.250mm (NPTH) |
0.350mm (PTH) 0.250mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
0.350mm (PTH) 0.250mm (NPTH) |
0.300mm (PTH) 0.200mm (NPTH) |
– |
– |
Min. Cu to board-edge – outer layers |
0.250mm (routed) |
0.250mm (routed), 0.450mm (V-cut) |
– |
0.250mm (routed), 0.450mm (V-cut) |
– |
0.250mm (routed), 0.450mm (V-cut) |
– |
Min. Cu to board-edge – inner layers |
0.400mm (routed) |
0.400mm (routed), 0.450mm (V-cut) |
– |
0.400mm (routed), 0.450mm (V-cut) |
– |
– |
– |
Extra features in copper |
– |
copper up to board edge, plated holes on the board edge, round edge plating |
– |
copper up to board edge, plated holes on the board edge, round edge plating |
– |
copper up to the board edge |
– |
Surface finish |
lead-free finish at our discretion for best price |
lead-free for best price, ENIG selective, LF HAL |
ENIG overall, Im Ag, HAL Pb/Sn
|
ENIG selective |
LF HAL, ENIG overall, Im Ag, HAL Pb/Sn
|
LF HAL |
– |
Soldermask type/colour |
Liquid Photo Image able – green |
LPI: green, black |
LPI: blue, red, white, clear |
LPI: green |
LPI: blue, red, white, clear |
LPI: white, black (white = default) |
– |
Legend colour |
white (no, one or both sides) |
white (no, one or both sides) |
yellow, black, white PIL |
white (no, one or both sides) |
yellow, black, white PIL |
black, white (black = default) |
– |
Extra options |
– |
peel able mask, via filling |
gold fingers, carbon pads, heat sink paste |
peel able mask, via filling |
gold fingers, carbon pads, heat sink paste |
– |
– |
Slots and cut-outs |
2.0mm tool |
0.5mm, 1.2mm, 2.0mm tool |
– |
0.5mm, 1.2mm, 2.0mm tool |
– |
2.0mm tool |
– |
Delivery panels (customer panels) |
– |
2.0mm break-routed, V-cut |
– |
2.0mm break-routed , V-cut |
– |
2.0mm break-routed , V-cut |
– |
Max. customer panel dimensions |
– |
350mm x 250mm |
425mm x 425mm and >8.75dm², larger – ask quotation |
350mm x 250mm |
425mm x 425mm and >8.75dm², larger – ask quotation |
550mm x 425mm, max 8.75dm² |
550mm x 425mm and > 8.75dm², larger – ask quotation |
Min. customer panel dimensions |
– |
50mm x 50mm |
– |
50mm x 50mm |
– |
50mm x 50mm |
– |
eC-registration compatible panel |
– |
Max 350mmx250mm, Min 50mmx50mm |
– |
Max 350mmx250mm, Min 50mmx50mm |
– |
Max 350mmx250mm, Min 50mmx50mm |
– |
Electrical test |
standard |
standard, option for 1L |
– |
standard |
– |
option |
– |
UL marking |
available |
available |
– |
not yet available |
– |
not yet available |
– |
Stencil material |
130µm stainless steel |
130µm stainless steel |
– |
130µm stainless steel |
– |
130µm stainless steel |
– |
Max. stencil size |
595 x 595 mm |
595 x 595 mm |
– |
595 x 595 mm |
– |
595 x 595 mm |
– |
The values of the technology parameters (except base material) under the “PCB proto” column are the Eurocircuits technology defaults. These are also used in “STANDARD pool” and “RF pool. In “STANDARD pool” and “RF pool” pooling limits and non-pooling limits are listed for all technology values.
To see all the eC-predefined build-ups for multi-layers, look online at the build-up wizard in our calculation program
For all services the aspect ration is 1 to 8
For more please see our current PCB Design Guidelines – Classification page.