Copper foils stand for the basic copper thickness applied on OUTER and INNER layers. The copper foil can be pre-attached by the laminate manufacturer to a base material core or it can be introduced in a multi layer board as copper foil before pressing.

Copper Foil

On INNER layers the final copper thickness remains that of the base copper foil. On OUTER layers we deposit extra 20-30µm copper on the tracks during the galvanic process for plating through the holes.

Note

For 1 layer and IMS boards there is no galvanic plating process.

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